An investigation on responses of thermoelastic interactions of transversely isotropic thick circular plate due to ring load with memory-dependent derivatives

Abstract The present investigation has focus on the variations in a transversely isotropic thick circular plate subjected to ring loading. modified Green Nagdhi (GN) heat conduction equation with and without energy dissipation by introducing memory-dependent derivatives (MDD) two temperatures been used model problem. General solutions field equations have found using Hankel Laplace transform. analytical expressions of stress, conductive temperature, components displacement are obtained transformed domain. Physical numerical inversion techniques. effects Kernel functions depicted graphically. also reveals some specific cases.